ECOTRON

How to minimize the ecological footprint for functional electronics?

A growing desire for continuous data collection, real time information and connectivity has resulted in increased demand for electronic functionalities that are fully integrated in everyday objects. Consumer electronics, healthcare, wearable electronics, IoT and smart packaging are examples of market segments that follow this trend. Printed circuit boards (PCBs) are the state-of-the-art technologies used to create electronic functions. However, this technology creates an ever increasing strain on the environment because recycling and/or dismantling of the PCB can hardly be done. A radical sustainability improvement requires disruptive electronics manufacturing processes, technologies and materials. Printed electronics are more environmentally friendly than the traditional PCB, due to their additive character (printing instead of etching), the absence of chemical etching materials, low energy demanding process conditions and possibility for recovery or re-use of substrates and (metallic) inks. Thereto, in ECOTRON, flexible, organic & printed electronics are advanced through a multidisciplinary approach involving biobased materials, innovative (print) processes, and device and module dismantling technologies. Furthermore, recycling technologies and standards will be developed that are eventually integrated in a process design for a printed electronics recycling plant. Simultaneously, the lifetime of printed electronics is improved for larger implementation of printed electronics into everyday products.

ECOTRON will create use-case demonstrators in existing state-of-the-art electronics products in consumer electronics, smart packaging, healthcare and wearable electronics market segments to demonstrate the potential environmental enhancements.

AMIRES was involved in the project’s preparatory phase and negotiations. AMIRES is assisting the coordinator with project management and is responsible for communication and dissemination.

• Partners:
  • NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO, The Netherlands
  • TEKNOLOGIAN TUTKIMUSKESKUS VTT OY, Finland
  • COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, France
  • INSTITUTO TECNOLOGICO DEL EMBALAJE, TRANSPORTE Y LOGISTICA, Spain
  • SIGNIFY NETHERLANDS BV, The Netherlands
  • BECTON DICKINSON FRANCE SAS, France
  • JANSSEN PHARMACEUTICA NV, Belgium
  • TECNICAS REUNIDAS SA, Spain
  • POLITECNICO DI MILANO, Italy
  • POLAR ELECTRO OY, Finland
  • AMIRES S.R.O., Czech Republic

Co-funded by the European Union. This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 101070167.